Hybrid high board ENIG manufacturer from China Sprint Circuits Co.,Ltd

Place of Origin:

Guangdong, China (Mainland)


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Product Detail

Number of Layers: 8-Layer

Copper Thickness: 1/1OZ

Min. Hole Size: 0.15MM

Base Material: rogers5880

Board Thickness: 2.2MM

Hybrid high board: Hybrid high board

1, the use of S1000-2 Rogers5880+FR4 plate mixed laminated production, Rogers5880 is a very expensive ceramic plate; in which L1-L2-L3-L4 is Rogers588

1, the use of S1000-2 Rogers5880+FR4 plate mixed laminated production, Rogers5880 is a very expensive ceramic plate; in which L1-L2-L3-L4 is Rogers5880 material;
2, blind and buried hole design, L1-L2 L1-L4, L5-L8, blind, blind L3-L4;
3, the resin filling process;
4, metal plate edge wrapping.

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